Differential Genix DGELF-POD | add2

Differential Genix DGELF-POD

The Genix DGELF-POD supports up to 16 I/O modules in a single plug-in card arrangement.

DGELF in the product title stands for Differential Genix POD with External and Internal Load capability with Fault Insertion.

What is a Genix DGELF POD?

Genix PODs are plug-in boards that comprise two or more circuit boards to maximise the use of the space within a sub-rack.

DGELF PODs have a front board with status LEDs, robust convenient terminations and sockets for Genix plug-in modules along with a plug-in fault insertion and optional load board.

1 to 16 Genix I/O modules may be installed as required, supporting up to 16 differential channels or 32 single-ended channels per POD.

DG Pod Smaller - Cropped Transparent

Note: Fault insertion board and optional load board removed for clarity

Why differential?

Many HIL systems are single-ended, meaning the 0V reference for each channel is brought back to a single point or series of points on the system. Our HIL systems are configurable between single-ended and differential to allow you to use specific reference points for some critical pins to reduce the chances of induced noise and ground offsets commonly found on larger systems.

Differential Load

The optional load board supports up to 16 channels of single-ended or differential loading capability with HIL I/O control options.

Differential fault insertion?

The fault insertion may also be configured for differential use where necessary by utilising the negative input pin’s fault channel.

How does the fault insertion work?

Each DGELF board has a further board built into the POD that allows each I/O line to be open circuited, shorted to one of two 0V lines or shorted to one of three supplies. In addition, each line can be shorted to another line via the ‘fault bus’.

In test scenarios it is thus possible to test for all the standard fault modes within the normal HIL environment.

If an I/O line takes excess current during the fault testing, the fault card protects itself against damage and reports a trip to ensure the test is invalidated.

To increase the current rating of a channel (to more than 40Amps) yit is possible to ‘group’ the channel.

Application note:

Fault insertion technology

Fault insertion, fault injection or FI solutions are used to apply the...

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I/O modules

The I/O modules are the “brains” of the POD, providing all signal conditioning or I/O generation via the on-board DSP.

Each POD may have one or more  I/O modules plugged into it, making efficient use of space within the system and providing good signal routing between the real-time-target and the ECU or system under test.

H3-DSP-COF

H3-DSP-COF Module

H3-DSP-CITF

H3-DSP-CITF Module

Intelligent I/O or signal conditioning

Genix PODs are available for both intelligent I/O modules and for pure signal conditioning modules.

H3-DGELF POD supports the H3 intelligent I/O modules.  H1-DGELF-POD supports the signal conditioning I/O range.

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H1-POD compatibility list

The following scrolling list shows which boards are compatible with H1-DGELF PODs.

H3-POD compatibility list

The following list shows which boards are compatible with H3-DG PODs.

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