Fault insertion, fault injection or FI solutions are used to apply the...Find out more
Differential Genix DGF-POD
The Genix DGF-POD supports up to 16 I/O modules in a single plug-in card arrangement.
DGF in the product title stands for Differential Genix POD with Fault Insertion.
What is a Genix POD?
Genix PODs are plug-in boards that comprise two or more circuit boards to maximise the use of the space within a sub-rack.
Typically a POD will have a front board with status LEDs, robust convenient terminations and sockets for Genix plug-in modules.
1 to 16 Genix I/O modules may be installed as required, supporting up to 16 differential channels or 32 single-ended channels per POD.
Note: Fault insertion board removed for clarity
Many HIL systems are single-ended, meaning the 0V reference for each channel is brought back to a single point or series of points on the system. Our HIL systems are configurable between single-ended and differential to allow you to use specific reference points for some critical pins to reduce the chances of induced noise and ground offsets commonly found on larger systems.
Differential fault insertion?
The fault insertion may also be configured for differential use when necessary by utilising the negative input pin’s fault channel.
How does the fault insertion work?
Each DGF board has a further board built into the POD that allows each I/O line to be open circuited, shorted to one of two 0V lines or shorted to one of three supplies. In addition, each line can be shorted to another line via the ‘fault bus’.
In test scenarios it is thus possible to test for all the standard fault modes within the normal HIL environment.
If an I/O line takes excess current during the fault testing, the fault card protects itself against damage and reports a trip to ensure the test is invalidated.
To increase the current rating of a channel (to more than 40Amps) the channels can be ‘grouped’.
The I/O modules are the “brains” of the POD, providing all signal conditioning or I/O generation via the on-board DSP.
Each POD may have one or more I/O modules plugged into it, making efficient use of space within the system and providing good signal routing between the real-time-target and the ECU or system under test.
H1-POD compatibility list
The following scrolling list shows which boards are compatible with H1-DGF PODs.
H1-4 ultra flexible signal conditioning modules
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H1-5 analogue output signal conditioning modules
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H1-6 config digital output signal conditioning modules
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H1-7 configurable input signal conditioning module
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H1-DCO digital current output sensor simulator module
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H1-DCSFI-xxV direct current single output fixed voltage with isolated output
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H1-OPP-5V protected 5V output module
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H1-Pinch sensor signal conditioning module
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H1-SRS safety restraint simulator module
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H1-SWS switch simulator output module
The HIL H1-SWS modules are fixed signal conditioning modules used for the simulation of switches....Find out more
H3-POD compatibility list
The following list shows which boards are compatible with H3-DGF PODs
H3 complex input/transducer simulator I/O module
The H3 complex input/transducer simulator module (H3-GDSP-CITF) is an I/O module designed for test applications requiring...Find out more
H3 complex output function distributed I/O module
The H3 complex output function simulator module (H3-GDSP-COF) is an I/O module targeted at test...Find out more
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