Genix Modules | add2

Genix Modules

H1-Pinch Module - Small CroppedGenix I/O modules provide signal conditioning for a wide range of automotive, industrial and aerospace interfaces. They provide the connection between the real-time simulator and the unit(s) under test. In a typical HIL system, up to 16 Genix modules will be inserted into each POD, which will then work in conjunction with other PODs in the same sub-rack, and other Genix equipment in additional sub-racks.

There are three main types of Genix modules. The first provides a range of low level I/O suitable for automotive and aerospace. The second, known as intelligent I/O modules, are fully configurable, ultra high speed, DSP processing and signal conditioning I/O modules designed for a wide range of test and verification applications, for example, automotive crank and cam signal generation.

Genix module tree

Genix I/O modules

Supports a wide range of I/O or signal conditioning functions

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H1-4_TileGenix I/O modules are small plug-in boards that support a wide range of I/O or signal conditioning functions, according to the range used.

These I/O modules plug into a ‘POD’, i.e. a board that can be plugged into a sub-rack.

Genix Intelligent I/O modules

On-board processing capability for simulating complex functions

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H3-DSP-COF_tileI/O interface hardware with a virtually limitless range of interface types. The basic hardware provides programmable gains, thresholds, resistances, current measurement and generation plus digital and frequency I/O, along with an angle engine for angle-based generation and measurement.

Additional features are then provided via firmware upgrades, as required.

Genix Distributed I/O modules

Used to simulate a variety of resistive and switch-based components

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H4-SA16_tileA range of modules designed to be used externally to the HIL rack to simulate a wide range of resistive or switching devices.

Typical applications include the simulation of fuel tank floats, relays and various sensors.