Genix PODs | add2

Genix PODs

DG Pod - Cropped - 1200x800Genix PODs are plug-in carriers that accommodate signal conditioning modules to maximise space within a sub-rack. PODs allows for the introduction of faults or loads to single-ended or differential I/O provided by the Genix modules.

1 to 16 Genix I/O modules may be installed as required, supporting up to 16 differential channels or 32 single-ended channel per POD. This allows for differential signals from the target systems and/or from the Genix boards, as well as ECMs to have different grounds, just like the target vehicle.

Integrated fault insertion greatly reduces the wiring length and cost as it subsequently reduces the voltage drops that would develop. The rear connect to low level I/O and from the simulator, whereas the front brings out the ruggedized, protected real-world signals for the system under test. These front connections either connect to the unit under test, or optionally to the side panel of the rack in large systems.

Genix POD tree

DG-POD

Differential Genix POD

View product

 

DG-POD_tileThe DG-POD supports a range of DSP-based I/O modules supporting up to 32 channels of fully configurable, single and differential I/O, with voltage, current, frequency, resistance and complex waveform capabilities.

Up to 16 DSP modules can be fitted to a DG-POD which may be configured via one or more distributed CAN networks to support an extensive range of applications.

DGF-POD

Differential Genix POD with Fault Insertion

View product

 

DGF-POD_tileThe HIL DGF-POD range of pods are configurable, differential input, signal conditioning I/O pods with internal Genix loading capability along with integrated fault insertion.

Two fault buses are supported allowing multiple pods to daisy-chain together to provide system wide, point-to-point, short circuit faults via one of the two fault buses.

DGELF-POD

Differential Genix POD with External and Internal Load capability with Fault Insertion

View product

 

DGELF-POD_tileThe DGELF-POD range of pods support a range of DSP based I/O modules supporting up to 32 channels of fully configurable, single and differential I/O, with voltage, current, frequency, resistance and complex waveform capabilities.

Up to 16 DSP modules can be fitted to the DGELF pod which may be configured via one or more distributed CAN networks to support and extensive range of applications.