H3 DDIN Distributed HIL Simulation Unit For Sensor Simulation


H4-DDINx4 Rail mounted distributed HIL simulation unitDIN rail-based I/O carrier for H3 I/O modules

This unit is a distributed HIL simulation unit, and carries up to four Genix H3 modules to support a wide range of simulation, test and measurement applications. Designed to be conveniently distributed around test systems such as HIL, these modules offer some of the widest interfacing capabilities available in the market today.

Typical applications include the generation of CAN-configurable vehicle dynamic signalling such as that from an engine or wheel speed sensors. In combination with custom hardware, these units can be configured to output sensor signals directly or simulate real automotive sensors.

The range of base units supports a range of DSP based I/O modules supporting up to 8 channels of fully configurable single ended or 4 channels of differential I?O, with voltage, current, frequency, resistance and complex waveform capabilities. Screw terminal connections provide the ECM I/O connections with up to 4 measurement references and 4 0V connections supported.


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• Highly configurable from CAN bus • Software & jumper selectable configurations
• Resistive loads may be configured internally • Optional complex functions (RVDT/LVDT)
 Simulink TSP available


Parameter Specification
ECM I/O- ±60V
ECM I/O+ ±60V
Imax out (continuous) 3A
Imax out (transient) 8A
Operating temperature +10..+50°C
Vt maximum 60V
Carrier board internal power dissipation 4W
DDIN base unit capacity 4 modules
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