Using complex I/O for special testing requirements
Using complex I/O and advanced interfacing requirements often require powerful hardware and software solutions to fulfil a wide range of test applications.
DSP-based solutions for complex I/O
Low-to-medium voltage interfacing requirements often cannot be met with off-the-shelf boards, due to limited capabilities or a fixed range of features.
This is where Genix comes in.
Using DSP-based I/O with reconfigurable capabilities, such as the H3 I/O module range, can offer wider scope to meet specialist applications, such as those encountered with avionics testing.
High levels of integration and configuration
Genix H3 series not only provides a number of specialist I/O features built in, it may also be used in a number of different physical formats and interfacing schemas.
Out-of-the-box H3 functions include:
- Analogue voltage input (variable gain)
- Digital voltage input (variable threshold)
- Wide ranges of resistance (higher than average power and voltage)
- Analogue current input
- Analogue voltage and current uutput
- Frequency and PWM input
- Frequency and PWM generation
- Configurable digital output
- Multi-channel angular waveform generation
All in a module smaller than a credit card.
Custom firmware
For a fixed price, it is possible to specify and have delivered special custom firmware to meet your exact needs.
Ratiometric measurements, frequency and phase measurements, pulse counting and so on, are all possible extensions to the range.
Related products
Genix
Genix is a range of technologies for hardware-in-the-loop simulation that allow engineers to re-configure and scale test environments quickly as requirements change.
Intelligent I/O
The H3 Intelligent I/O module range is targeted at test applications requiring functions biased towards single-ended voltage/current/resistance sensor simulations.
COMMDongle
The COMMDongle is a convenient, robust, and physically compact tool for CAN interfacing, logging and analysis. It offers full galvanic isolation and logging of multiple 2.0b buses.