H3-DDINx4
DIN rail-based I/O carrier for H3 I/O modules This unit is a distributed...
Find out morePublished on 22nd January 2013
Posted in in Automotive, Distributed systems, I/O and signal conditioning, Mathworks/simulation
Moving towards ever-more flexible HIL systems, add2 announces the release of its third-generation hardware-in-the-loop I/O products, to be known as H3.
Offering more flexible and capable I/O and suitable for both rack-based and distributed applications, this release ingrates signal generation and measurement into the same volume as previous generations of powerful Genix signal conditioning boards.
See The Genix Family for more information.
Complex input/transducer simulator I/O module The Genix GDSP-CITF sensor simulator module are fully...
Find out moreComplex output function distributed I/O module Genix GDSP-COF I/O modules are HIL modules...
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