add2 Introduces Its Third-generation HIL Systems | add2

add2 Introduces Its Third-generation HIL Systems

Published on 22nd January 2013

Posted in in Automotive, Distributed systems, I/O and signal conditioning, Mathworks/simulation

Moving towards ever-more flexible HIL systems, add2 announces the release of its third-generation hardware-in-the-loop I/O products, to be known as H3.

Offering more flexible and capable I/O and suitable for both rack-based and distributed applications, this release ingrates signal generation and measurement into the same volume as previous generations of powerful Genix signal conditioning boards.

See The Genix Family for more information.

Product Links

H3-DDINx4 distributed HIL simulation unit


DIN rail-based I/O carrier for H3 I/O modules This unit is a distributed...

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H3-DSP-CITF sensor simulator module


Complex input/transducer simulator I/O module The Genix GDSP-CITF sensor simulator module are fully...

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H3-DSP-COF HIL modules with waveform generation


Complex output function distributed I/O module Genix GDSP-COF I/O modules are HIL modules...

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